Server Manufacturing Levels Defined
服务器的ODM,OEM为了分工协作，开发出各种各样的商业模式和交付方式，分为L1-L12
目前品牌商使用L9 或者L6 的比较多,平时较为常见.
L1：零件制造 - 包括非涂漆零件和零部件级别的模具制造。
L2：零件子装配 - 进行一定程度的组装。
L3：金属和塑料材料组合在一起，作为一个机箱（即底盘）发货。
L4：金属和塑料材料+电源单元（PSU）和/或扁平电缆和/或背板作为套件或袋装发货。
L5：所有等级 4 的机箱部件连接，集成电缆，进行输入/输出测试。
L6：将主板集成到机箱内并进行上电测试。
L6 生产的平台是 ODM（原始设计制造商）提供的“裸机服务器”，这些服务器是集成的主板/机箱组合，其中包含零件，但缺少 CPU、内存、硬盘、网络卡等组件。通常，系统集成商会购买这些裸机，并添加组件以创建特定的服务器配置。系统集成商能够在下一等级中添加多少价值和服务，取决于其在以下等级中的能力：
L7：将插卡集成到裸机服务器，并具备测试能力。
L8：将硬盘集成到裸机服务器，并具备测试能力。
L9：将 CPU 和内存集成到裸机服务器，并具备测试能力。
L10：完整组装服务器，并进行全系统和零部件级别的测试、操作系统/软件集成，以及包含用户手册和其他所需文件的产品组装，交付成为完全集成的服务器解决方案。
能够生产等级 10 的制造商将提供一个可工作的服务器解决方案。但是，如果需要将多台服务器网络连接在一起，形成机架级别甚至多机架级别的解决方案，则至少需要等级 11 的制造商（如 AMAX）：
等级 11：节点级组装、测试，所有服务器节点的操作系统/软件加载，然后将节点组装到机架中，包括完整的电缆网络连接（包括交换机），并进行机架级别或多机架级别的完整解决方案测试。
等级 12：在等级 11 的基础上，进行机架到多机架级别的制造，包括所有网络连接，完整的软件加载、验证和优化。这可能包括但不限于群集管理、云操作系统（如 OpenStack）和网络软件。
Level 1: Parts manufacturing — this includes non-painted parts and molding parts on the component level.
Level 2: Piece Parts Sub Assembly — some level of assembly.
Level 3: Metals and plastics are integrated together and shipped as a case (i.e. chassis).
Level 4: Metals and Plastics + PSU and/or Flat Cable and/or Backplane are shipped as a kit or bag.
Level 5: All enclosure parts from Level 4 attached, cables integrated, I/O tested
Level 6: Integration of motherboard into chassis enclosure and power on test.
Level 6 manufactured platforms are what ODMs provide when they ship out “server barebones” which are integrated motherboard/chassis combinations with parts included, but missing components such as CPU, memory, hard drives, networking cards, etc. Often systems integrators will buy these barebones and populate with components to create specific server configurations. How much value that integrator can add in terms of services and further building out the solution depends on their capabilities in the next levels:
Level 7: Integration of add-on cards into server barebone with ability to test.
Level 8: Integration of hard drives into server barebone with ability to test.
Level 9: Integration of CPU and memory into server barebone with ability to test.
Level 10: Full assembly of server with full system and component level testing, OS/software integration, product kitted with user manual and other required documentation and delivered as a fully-integrated server solution.
A manufacturer capable of up to Level 10 manufacturing will deliver a working server solution. But if you need multiple servers networked together as a rack-level or even multi-rack level solution, you will need at least a Level 11 manufacturer (like AMAX):
Level 11: Node-level assembly, testing, OS/software loading of all server nodes followed by rack cabinet assembly of nodes into racks with full cable networking (including switches), and tested as a working total solution at the rack or multi-rack level.
Level 12: Rack to multi-rack level manufacturing featured in Level 11 including all networking with full software loading, validation and optimization. This may include but is not limited to cluster management, cloud OS (such as OpenStack) and networkingsoftware.
